An article on four methods to accelerate the curing of epoxy adhesive

Epoxy adhesive is a widely used adhesive with advantages such as high bonding strength, good waterproof and oil proof effect after curing. In use, many enterprises need to increase the curing speed of epoxy adhesive in order to improve production efficiency. So how to accelerate the curing speed of epoxy adhesive?

01 Heating curing

Heating cycloaliphatic epoxy adhesive within a certain temperature range can effectively improve the curing speed of the adhesive. Epoxy adhesive is a type of adhesive mainly made of specialty epoxy resins, which often requires heating and curing. The higher the temperature, the faster the curing speed. For example, a certain model of two-component epoxy adhesive can fully cure at room temperature for 24 hours, but it can fully cure in 1 hour at 75 ° C. Heating and curing of epoxy adhesive requires the use of some heating tools, such as ovens, air conditioners, and electric fans.

02 Control the time for pouring glue

Epoxy adhesive is divided into two-component epoxy adhesive and single component epoxy adhesive. For single component epoxy adhesive, the material can be prepared first, wait for a period of time before use, and wait for the adhesive amount to react before pouring. This can accelerate curing, but the time should be controlled well, not too long, otherwise the adhesive will solidify prematurely.

03 Increase the amount of curing agent

The main components of epoxy adhesive are epoxy resin, monomers, and curing agents, among which the curing agent plays an important role in the curing speed. Within a certain range, increasing the amount of curing agent can effectively improve the curing speed of adhesive. Additionally, it is possible to switch to some highly active promoters.

04 Control the dispensing amount

The amount of glue applied should be appropriate. If too much epoxy glue is applied at once, it naturally takes longer to fully cure. If too little glue is applied, although the glue curing speed is fast, it cannot meet the bonding requirements, which affects the bonding effect of the glue.