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With the diversification of electronic components, integration, miniaturization, the development trend of high performance, the performance of electronic adhesives put forward higher requirements. As most electronic components are more sensitive to temperature, can not withstand high temperatures, so the curing process requirements for the adhesive is a low-temperature fast curing, and the performance requirements of the adhesive in addition to excellent bonding strength and reliability, but also low yellowing and good storage stability.
Ingredient | |
TTA21P | 45 |
Specialty cycloaliphatic epoxy | 35 |
Activated Diluent | 10 |
Toughened Agent | 10 |
High performance Thermal Cationic Initiator | 1 |
Appearance of cured material before and after heat aging
For one-component medium-temperature epoxy adhesives generally have a slow curing speed at medium temperature (60 ℃ - 80 ℃) or short operable time at room temperature. In order to solve such problems, it can be realized by thermal cation curing of TTA cycloaliphatic epoxy resin, through the cooperation of cycloaliphatic epoxy resin and high performance thermal cationic initiator, it can be cured quickly at 60℃ for 30min, and the system stability is better, the operation time is long, and there is no change in viscosity at room temperature for 2h, in addition, the cured material has high transparency, excellent yellowing resistance, and it has a potential application prospect in the field of optoelectronic display.
Curing Performance | ||
Curing Condition | 60℃*30min | |
Hardness (Shore D) | ＞80 | |
Transmittance（400-700nm） | 90-92% | |
Stability（25℃*2h） | No viscosity change | |
Yellowing(Δb) | 100℃*2h | 0.03 |
150℃*2h | 0.32 | |
200℃*2h | 1.53 | |
QUV*720h | 1.06 | |
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