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Electronic potting compounds exist in liquid form with fluidity prior to curing, and the viscosity of the liquid adhesive varies depending on the material composition, performance characteristics, and production processes of the product. Only after complete curing can the potting compound realize its functional value, achieving effects such as waterproofing/moisture resistance, dustproofing, electrical insulation, thermal conductivity, confidentiality protection, corrosion resistance, temperature tolerance, and vibration damping.
There are many types of electronic potting compounds, mainly including: thermal conductive potting compounds, epoxy resin potting compounds, silicone potting compounds, polyurethane potting compounds, and LED potting compounds.
Thermal Conductive Potting Compound (HCY) is a low-viscosity, flame-retardant, two-component addition-curing silicone thermal conductive potting compound. It can be cured at room temperature or accelerated by heating, with the characteristic that the higher the temperature, the faster the curing process. This compound is developed by adding thermal conductive fillers to ordinary potting silicone or adhesive silicone. Products from reputable manufacturers typically have the following features:
No by-products are generated during the curing reaction.
It can be applied to surfaces of materials such as PC (Poly-carbonate), PP, ABS, PVC, and metals.
It is suitable for thermal conduction, insulation, waterproofing, and flame retardancy in electronic components, with flame retardancy meeting the UL94-V0 rating.
It complies with the EU RoHS directive.
The main application areas include potting of electronic and electrical components and assemblies, and it is also used in applications such as temperature sensor potting.
The epoxy resin potting compound meets the EU ROHS directive standards. It features high hardness, smooth surface, and good gloss of the cured material, and possesses characteristics such as fixing, insulation, waterproofing, oil resistance, dustproofing, confidentiality, corrosion resistance, aging resistance, and resistance to thermal shock. It is used for the encapsulation of electronic transformers, AC capacitors, negative ion generators, aquarium pumps, ignition coils, electronic modules, and LED modules. It is suitable for potting of small and medium-sized electronic components, such as automotive and motorcycle ignition systems, LED driver power supplies, sensors, toroidal transformers, capacitors, triggers, LED waterproof lights, and the confidentiality, insulation, and moisture-proof (water) potting of circuit boards.
There are many types of silicone potting compounds. Different types of silicone potting compounds vary significantly in terms of temperature resistance, waterproofing, insulation, optical properties, adhesion to different materials, and hardness. Silicone potting compounds can be enhanced with functional fillers to impart properties such as electrical conductivity, thermal conductivity, and magnetism. Generally, silicone potting compounds have relatively low mechanical strength. However, this characteristic is leveraged to make them “easily breakable” for maintenance purposes. In other words, if a component fails, the potting compound can simply be pried open, the faulty component replaced, and the device can be reused.
The color of silicone potting compounds can generally be adjusted according to requirements. They can be transparent, opaque, or colored. Silicone potting compounds perform very well in terms of shock resistance, electrical properties, waterproofing, temperature resistance (both high and low), and aging resistance.
Two-component silicone potting compounds are the most common. These compounds are divided into two types: condensation-curing and addition-curing. Generally, condensation-curing compounds have relatively poor adhesion to electronic components and the potting cavity. They release volatile by-products during the curing process and exhibit a significant shrinkage rate after curing. On the other hand, addition-curing compounds (also known as silicone gels) have minimal shrinkage and do not produce low-molecular-weight by-products during curing. They can be rapidly cured by heating.
Polyurethane potting compound, also known as PU potting compound, is typically composed of polyols (such as polyesters, polyethers, and polybutadienes) and diisocyanates, with diols or diamines used as chain extenders. It is formed through a stepwise polymerization process. The potting compound can generally be prepared using either the prepolymer method or the one-step method.
Polyurethane potting compounds, also known as PU potting compounds, are characterized by their low hardness, moderate strength, good elasticity, water resistance, mold resistance, shock resistance, transparency, excellent electrical insulation, and flame retardancy. They are non-corrosive to electronic components and offer good adhesion to metals such as steel, aluminum, copper, and tin, as well as to rubber, plastic, and wood. These compounds protect installed and calibrated electronic components and circuits from the effects of vibration, corrosion, moisture, and dust.
LED potting compound is an auxiliary material used in LED packaging. It features a high refractive index and high light transmittance, which can protect the LED chips and increase the luminous flux of LEDs. It has low viscosity, making it easy to degas, and is suitable for potting and mold pressing. This compound ensures better durability and reliability for LEDs.
Characteristics:
Low Viscosity and Good Flowability: Suitable for molding complex electronic components.
Forms a Soft Rubber-Like Material After Curing: Provides excellent impact resistance.
Excellent Heat Resistance, Moisture Resistance, and Cold Resistance: Extends the lifespan of electronic components after application.
Addition-Curing Type: Can be cured at room temperature or accelerated by heating.
Superior Moisture and Water-Proofing Effects.
Applications:
Used for high-power streetlight power supplies, power modules, HID lamp power modules, solar junction box potting protection, LED electronic displays, LED electronic potting compounds, potting of printed circuit boards, bonding of power cables, high-power LED and LCD lights, mobile phones, power boxes, ultra-thin computers, game consoles, digital cameras, airport runways, etc.
Usage Method:
Electronic potting compounds are divided into manual potting and machine potting. The addition-curing type with a 1:1 ratio is suitable for machine potting. The 1:1 ratio is expected to be the most widely used in the future market.
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